搜索结果: 1-1 共查到“电子科学与技术其他学科 Gold”相关记录1条 . 查询时间(0.14 秒)
Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads
GANG Bonding Gold-Plated TAB Outer Leads
2011/1/5
This paper presents the evaluation results of thermocompression GANG Bonding of gold-plated TAB outer leads to three kinds of metallized ceramic substrates. Gold-Selective Plating (GSP) substrates for...