搜索结果: 1-15 共查到“电子科学与技术 Thermal”相关记录16条 . 查询时间(0.015 秒)
A HIGHLY PRECISE AND LINEAR IC FOR HEAT PULSE BASED THERMAL BIDIRECTIONAL MASS FLOW SENSOR
Thermal mass flow sensor calorimetric sensor heat pulse bidirectional
2015/1/20
In this work we have designed and simulated a thermal bi-directional integrated circuit mass flow sensor. The approach used here was an extension to the gas flow model given by Mayer and Lechner. The ...
Thermal Effect and Frequency Response Analyses on Heterojunction Bipolar Power Transistor
Thermal Effect Frequency Response Heterojunction Bipolar Power Transistor
2010/12/8
Heterojunction bipolar transistors (HBT) based on Npn AlGaAs/GaAs material system have attracted considerable attention for microwave power and digital applications due to their high speed and high cu...
Thermal Placement in Hybrid Circuits—A Heuristic Approach
Thermal Placement Hybrid Circuits A Heuristic Approach
2010/12/15
This paper deals with the placement of heat dissipating components in hybrid circuits. An optimum placement is found when the extreme temperatures on the substrate are minimized. Whereas classical tec...
Influence of Thermal Treatment Under Various Oxygen Pressures on The Electronic Properties of Ceramics and Single Crystals of Pure and Tin-Doped Indium Oxide
Thermal Treatment Oxygen Pressures Tin-Doped Indium Oxide
2010/12/16
The different electronic behaviors of pure and tin-doped indium oxides with various thermal treatments under high and low oxygen pressure are discussed on the basis of the evolution of the band energy...
Influence of Thermal Treatment on The Electronic Properties of ITO Thin Films Obtained by RF Cathodic Pulverization. Study of Solar Cells Based on Silicon/(RF Sputtered) ITO Junctions
ITO Thin Films RF Cathodic Pulverization Solar Cells Silicon/(RF Sputtered) ITO Junctions
2010/12/16
ITO (Indium Tin Oxide) thin films obtained by R.F cathodic sputtering have been studied. The influence of thermal treatment on the electronic properties of the films has been particularly investigated...
Thermal analysis during the design process is an essential step towards the achievement of high reliability in modern high density hybrid and integrated circuits. Thermal analysis is also essential fo...
Size Effects on Thermal Properties of Thin Metal Films With Rough Surfaces
Thermal Properties Thin Metal Films Rough Surfaces
2010/12/16
By calculating the effects of electronic scattering at rough surfaces by means of a combined Soffer-Cottey model, general theoretical expressions for the size effects in thermal properties of thin met...
Modelling Thermal Resistance of Power Modules Having Solder Voids With Finite Elements
Thermal Resistance Power Modules Solder Voids Finite Elements
2010/12/21
A general thermal model to calculate the thermal resistance of a power module having rectangular die and layers has been constructed. The model incorporates a finite element computer program to solve ...
The Relationship Between the Electrical Properties of Thick Film Resistors and the Thermal Expansion Coefficient of the Substrates
Thick Film Resistors the Thermal Expansion Coefficient the Substrates
2010/12/21
The temperature characteristics of RuO2-based thick film resistors on various substratcs having different thermal expansion coefficient have been investigated.It became clear that, if the thermal expa...
Thermal and Electrical Analysis of Solid Aluminium Capacitors
Capacitors solid aluminium ripple current thermal analysis heat transfer
2010/12/21
The thermal properties of electronic components partly determine the reliability of electronic equipment. For electrolytic capacitors, they also set the limits for the ripple current and voltage value...
A Large Scale Hybrid Thermal Print Head
heating resistor dots Hybrid Thermal Print Head film circuit substrate
2010/12/27
A high speed direct drive thermal print head, which prints across a 216 mm wide paper using 1728 heating resistor dots (8 dots/mm) has been developed.It can print 30 cm long paper in only a few second...
Design of a 108 Pin VLSI Package With Low Thermal Resistance
a 108 Pin VLSI Package Low Thermal Resistance
2010/12/27
The design of a 108 pin VLSI package is described. The package has low thermal resistance and can, therefore, dissipate 4 watts of power. The package design is now being used commercially in high-end ...
Computer Simulation of Hybrid Integrated Circuits Including Combined Electrical and Thermal Effects
Hybrid Integrated Circuits Combined Electrical Thermal Effects
2010/12/27
This paper describes the application of a modern general purpose network analysis programme SPICE2 for the electrothermal analysis of hybrid integrated circuits. Self thermal coupling effects are mode...
Selective Glaze for Last Line Visible Thermal Head
a thermal head the last line the selective glazed layer
2010/12/29
A thermal head in which the last line is visible allows characters to be viewed as soon as they are printed. The thermal head is constructed with a selective glazed layer and heat sources, which are f...
Empirical Results Establishing the Thermal Independence of the Grain-Boundary Reflection Coefficient
the Thermal Independence the Grain-Boundary Reflection Coefficient
2011/1/10
Starting from the effective Fuchs–Sondheimer model of electronic conduction in thin polycrystalline films and implementing the asymptotic expressions of conductivity it is shown that the hypothesis of...