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Optical I/O for Chip-to-Chip Interconnects on CMOS Platform
Optical interconnects Subsystem integration and techniques Photonic integrated circuits Polymer active devices Modulators Photodetectors
2015/5/22
Optical devices on a CMOS die and package for terabit computing are discussed.200Gbps transmission is accomplished with a 1x10 VCSEL array. CMOS backend compatible modulators and photodetectors are de...
Compact and High-Density Opto-electronic Transceiver Module for Chip-to-Chip Optical Interconnects
Optoelectronics Integrated optoelectronic devices
2015/5/21
We fabricated an opto-electronic transceiver module on a flexible printed circuit board without using a lens array. 10Gbps data transmission through polynorbornene-based waveguide is achieved with low...
Compact and High-Density Opto-electronic Transceiver Module for Chip-to-Chip Optical Interconnects
Optoelectronics Integrated optoelectronic devices
2015/5/21
We fabricated an opto-electronic transceiver module on a flexible printed circuit board without using a lens array. 10Gbps data transmission through polynorbornene-based waveguide is achieved with low...
Bounded Linear Regularity, Strong CHIP, and CHIP are Distinct Properties
conical hull intersection property Bounded Linear Regularity Distinct Properties
2009/1/16
Bounded linear regularity, the strong conical hull intersection property (strong CHIP), and the conical hull intersection property (CHIP) are properties of a collection of finitely many closed conve...
20Gbps/ch Optical Interconnection between SERDES Devices over Distances from Chip-to-Chip to Rack-to-Rack
Optical Interconnection SERDES Devices Distances Chip-to-Chip Rack-to-Rack
2015/8/3
20-Gbps signal transmission of up to 100m between two SERDES devices has been demonstrated using newly developed driver and receiver ICs tuned to the characteristics of VCSELs, photodiodes, and electr...