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Comparative Study of Statistical Distributions in Electromigration-Induced Failures of Al/Cu Thin-Film Interconnects
Statistical Distributions Electromigration-Induced Failures Al/Cu Thin-Film Interconnects
2010/12/15
In electromigration failure studies, it is in general assumed that electromigration-induced failures may be adequately modelled by a log-normal distribution. Further to this, it has been argued that a...