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Gold paste of the mixed bond type was recognized as superior in adhesion to alumina substrate, while that of the fritless type was found superior in adhesion to the fired dielectric paste and wire bon...
Process and Accelerated Aging Test of GANG Bonding for Gold-Plated TAB Outer Leads
GANG Bonding Gold-Plated TAB Outer Leads
2011/1/5
This paper presents the evaluation results of thermocompression GANG Bonding of gold-plated TAB outer leads to three kinds of metallized ceramic substrates. Gold-Selective Plating (GSP) substrates for...