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A chip and wire, high density packaging approach has resulted in a low cost, large scale, high density, multi-chip package (MCP). The package includes 76 ICs, 1 resistor, and 34 capacitor chips on a 2...
Tape Automated Bonding for High Density Packaging
Tape Automated Bonding High Density Packaging
2011/1/5
High density packaging of semiconductor devices is necessary for high performance in compact electronic systems. But the assembly technology must also remain cost attractive.
Through the development ...